New Original Avago AFBR-57D7AMZ
Avago 8G SW AFBR-57D7AMZ-QL SFP+ Fibre Channel Transceiver Module
Condition: Brand New Factory Sealed
Warranty: 3-Year
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Introduction
Avago Technologies Quality system includes an ongoing Reliability Monitoring program to generate a database from which this reliability datasheet is published.

Description
The AFBR-57D7AMZ is in full compliance to IEEE 802.3ae requirements for 8GBASE-SR performance. The transceiver includes a transmitter that employs a Vertical Cavity Surface Emitting Laser (VCSEL) at 850nm. The receiver includes a highly reliable PIN photodiode and conventional limiting output postamplifier. The transceiver is compliant with the SFF Committee documents 8431, 8432 and 8472. The LC Duplex optical connector interface conforms to ANSI TIA/EIA604-10 (FOCIS 10A). The transceivers are lead free and RoHS compliant.

Reliability Qualification
The transceivers have been qualified in accordance with the requirements of Telcordia Document GR-468-CORE. Reliability predictions follow the method of Telcordia-SR-332. Avago internal test specifications have also been applied. Testing was carried out under the supervision of Avago Technologies Quality & Reliability Department.

Stress Test Pass Criteria
Product failure has occurred when the unit fails to respond properly to a functional test. The functional test condition shall not exceed the data sheet limits.

FIT Rate Summary
FIT rate for the SFP+SR Gen 2 8 GBd module is calculated as 122, corresponding to a mean time to failure (MTTF) of 8.2E6 hours.

Conclusion
The SFP+SR Gen 2 modules have completed and passed the reliability qualification points defined by Avago Technologies’ Quality and Reliability requirements.

Random Failure Rate (FIT) Calculation
Failure in time rate, or FIT, is defined as the number of failures per billion device hours. In the product useful life region, the random failure rate is considered as a constant failure rate. In this region MTTF, Mean Time to Failure, is defined as MTTF = 1/FIT.

FITs Prediction Based on Telcordia SR-332 Part Count Procedure
The Telcordia parts count method assumes that the module failure rate is equal to the sum of the device component failure rates. Modifiers are included to take into consideration variations in module operation environments, device quality requirements, temperature, and stress. The table that follow shows the FITs for the components used in the module and the total FITs which has been calculated for a case temperature of 40° C.

Device Type: Transceiver module
Form Factor: Plug-in module
Interface (Bus) Type: SFP (mini-GBIC)
Data Link Protocol: 8Gb Fibre Channel
Packing:New Retail